Saw Wire – MARUBISHI | The manufacturer of extra fine steel wire

Saw Wire CP

This product is high strength steel wire for core wire of diamond wire with high adhesion to diamond abrasive grains and excellent slicing performance.

Characteristics

Having high adhesion to abrasive grains in all fixed abrasive grain types for nickel-plating, brazing, and resin bonding.
Having high slicing performance using our proprietary manufacturing technology enabling uniform plating thickness and finishing with high strength and high roundness.
Hard to break and excellent in durability with ultra-high cleanliness steel used for the base material.
Also available for free abrasive grain saw wire as well as diamond wire.
We also receive small orders such as samples. Please contact us.

Applications

Core wire of diamond wire, which cuts silicon for solar cells
Free abrasive grain saw wire, which cuts materials, such as sapphire for LED lighting, ceramics, and magnet

Specifications

Saw Wire CP

Diameter	Tensile Strength (N/mm²)	Breaking Strength (N)	Diameter Tolerance (mm)	Diameter Deviation (mm)	Plating
0.05mm	3,900 over	7.6 over	±0.001	≦0.001	Copper plating
0.06mm	3,900 over	11.0 over	±0.001	≦0.001	Copper plating
0.07mm	3,900 over	15.0 over	±0.001	≦0.001	Copper plating
0.08mm	3,900 over	19.6 over	±0.001	≦0.001	Copper plating
0.09mm	3,800 over	24.2 over	±0.001	≦0.001	Copper plating
0.1mm	3,800 over	29.9 over	±0.001	≦0.001	Copper plating
0.11mm	3,800 over	36.2 over	±0.001	≦0.001	Copper plating
0.12mm	3,800 over	43.0 over	±0.001	≦0.001	Copper plating
0.14mm	3,500 over	54.0 over	±0.001	≦0.001	Copper plating
0.16mm	3,200 over	64.0 over	±0.001	≦0.001	Copper plating
0.18mm	3,100 over	79.0 over	±0.001	≦0.001	Copper plating
0.2m	3,000 over	94.5 over	±0.001	≦0.001	Copper plating
0.24mm	2,900 over	130.0 over	±0.001	≦0.001	Copper plating